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Improving solder release during solder paste printing! Metal mask cleaning agent.

Prevents residue from cleaning agents! A metal mask cleaning agent that achieves stable printing quality.

Are the residues left after cleaning causing the next defects? Some cleaning agents that emphasize cleaning power leave sticky residues after drying. Such residues can affect the solder release properties and stencil release properties of metal masks, potentially leading to a decline in printing quality and the occurrence of defects. The HA series of metal mask cleaning agents is designed to maintain high cleaning performance while minimizing residues after cleaning, keeping the openings and the surface of the metal mask in a clean state. It ensures stable solder transfer performance and contributes to reducing printing variations and stencil release defects, supporting continuous quality improvement and yield enhancement.

  • Cleaning agents
  • Improvement of metal mask cleaning agent

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